Investigating Multiphase and Multiscale Plasma-Material Interactions

The Gordon Research Seminar on Plasma Processing Science is a unique forum for graduate students, post-docs, and other scientists with comparable levels of experience and education to present and exchange new data and cutting edge ideas.

The focus of this meeting is on plasma interaction with materials/condensed matter as it is present in most of the plasma-related technological applications such as in medicine, agriculture, surface processing and nanofabrication. The meeting will highlight recent progress in the investigation of the different phases involved in plasma-material interactions addressing the large span of time and size scales. To approach these challenges, both experimental and computational methods will be discussed.

Participants are encouraged to present their unpublished, cutting-edge research, discuss scientific results with experienced leaders in the field and build networks with peers during ample time provided for socializing and informal discussions. To support this atmosphere, the whole meeting is strictly off-the-record with no abstracts published online and a no-photo policy during the scientific sessions. The mentorship component in the 2022 GRS will address the challenges in choosing a promising plasma research topic for their career. A leading plasma physicist as well as early stages researchers will participate in a panel discussion.

Application Instructions

The seminar will feature approximately 10 talks and 2 poster sessions. All attendees are expected to actively participate in the GRS, either by giving an oral presentation or presenting a poster. Therefore, all applications must include an abstract.

The seminar chair will select speakers from abstracts submitted by April 24, 2022. Those applicants who are not chosen for talks and those who apply after the deadline to be considered for an oral presentation will be expected to present a poster. In order to participate, you must submit an application by the date indicated in the Application Information section above.